Release 14 is here - 6Sigma ET

The latest release of 6SigmaET accelerates electronics design at all stages of the process—from data input to the final solve. Here’s how:

What's New Document

Download Release 14

Release 14 Features

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6SigmaET Optimization

Optimize heatsink geometry, fan speeds or heat spreader design using R14’s new Design of Experiments (DOE) and optimization functionality
Find the best solution for your system design by balancing thermal requirements with other design constraints such as weight, size and cost
Cut down on simulation time by exploring design space with a single data set
Combine DOE analysis with the fastest solver available in the market

6SigmaET Neutral File Format (ECXML)

Share thermal models easily across different toolsets using ECXML, a vendor neutral file format. ECXML allows the import and export of a wide range of objects–along with material properties and environment settings
Import and export PCBs, solids, heatsinks, fans, 2R components, chassis, sub-assemblies, heat sources, vents and porous obstructions

6SigmaET Unified Solver

Submit jobs through the streamlined job submission platform
Solve on your PC, HPC Cluster, Public Cloud (Rescale) and Private Cloud
View all jobs and statuses regardless of solve location

6SigmaET Temperature Dependent Power Map

Add multiple temperature dependent power maps to components
Model throttling when working with power maps